Technical Program Committee Members

Nilanjan Banerjee, University of Arkansas, USA
Zhipeng Cai, Georgia State University, USA
Jiannong Cao, Hong Kong Polytechnic University, Hong Kong
Qing Cao, University of Tennessee, USA
Mihaela Cardei, Florida Atlantic University , USA
Sriram Chellappan, Missouri University of Science and Technology, USA
XiaoWen Chu, HongKong Baptist University, HongKong
Mooi Choo Chuah, Lehigh University, USA
Yong Cui, TsingHua University, China
Ling Ding, University of Washington Tacoma, USA
Thang Dinh, Virginia Commonwealth University, USA
Hongwei (David) Du, Harbin Institute of Technology, China
Jie Gao, Stony Brook University, USA
Sandeep Gupta, Arizona State University, USA
Song Han, University of Connecticut, USA
Xiaohua Jia, City University of Hong Kong, Hong Kong
Donghyun Kim, North Carolina Central University, USA
Santosh Kumar, University of Memphis, USA
Jie Li, University of Tsukuba, Japan
Xiang-yang Li, Illinois Institute of Technology, USA
Yingshu Li, Georgia State University, USA
Wei Lou, HongKong PolyTech, HongKong
Satyjayant Mishra, New Mexico State University, USA
Nam Nguyen, Towson University, USA
Hui Pan , Hong Kong University of Science and Technology, Hong Kong
Symeon Papavassiliou, National Technical University of Athens, Greece
Wei Pen, National University of Defense Technology, China
Ravi Prakash, University of Texas at Dallas, USA
Kui Ren, University at Buffalo, State University of New York, USA
Rik Sarkar, Free University & Technical University, Berlin
Yilin Shen, Samsung Research America
Yan Shi, University of Wisconsin - Platteville, USA
Zhou Su, Waseda University, Japan
Li Wang, Taiyuan University of Technology, China
Wenye Wang, North Carolina State University, USA
Xin Wang, Stony Brook University, USA
Xinbing Wang, Shanghai Jiao Tong University, China
Yu Wang, Univeristy of North Carolina at Charlotte, USA
Weili Wu, University of Texas at Dallas, USA
Yang Xiao, University of Alabama, USA
Guoliang Larry Xue, Arizona State University, USA
Qiang Yan, Taiyuan University of Technology, China
Wensheng Zhang, Iowa State University, USA
Ying Zhao, TsingHua University, China
Jiaofei Zhong, University of Central Missouri, USA
Hongzi Zhu, Shanghai Jiao Tong University, China